TOKYO--(BUSINESS WIRE)--Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today introduced the RA8E1 and RA8E2 microcontroller (MCU) groups, extending the industry’s most powerful series of MCUs. Introduced in 2023, the RA8 Series MCUs are the first to implement the Arm® Cortex®-M85 processor, enabling them to deliver market-leading 6.39 CoreMark/MHz1 performance. The new RA8E1 and RA8E2 MCUs offer the same performance but with a streamlined feature set that reduces costs, making them excellent candidates for high-volume applications such as industrial and home automation, office equipment, healthcare, and consumer products.
The RA8E1 and RA8E2 MCUs deploy Arm Helium™ technology, Arm’s M-Profile Vector Extension that provides up to a 4X performance boost for digital signal processor (DSP) and machine learning (ML) implementations versus MCUs based on the Arm Cortex-M7 processor. This performance uplift enables applications in the fast-growing field of AIoT where high performance is crucial to execute AI models.
RA8 Series devices integrate low power features and multiple low power modes to improve power efficiency, even while providing industry-leading performance. A combination of low power modes, independent power domains, lower voltage range, fast wakeup time and low typical active and standby currents enables lower overall system power and allows customers to lower overall system power consumption and meet regulatory requirements. The new Arm Cortex-M85 core also performs various DSP/ML tasks at much lower power.
RA8 Series MCUs are supported by Renesas’ Flexible Software Package (FSP). The FSP enables faster application development by providing all the infrastructure software needed, including multiple RTOS, BSP, peripheral drivers, middleware, connectivity, networking, and TrustZone support as well as reference software to build complex AI, motor control and cloud solutions. It allows customers to integrate their own legacy code and choice of RTOS with FSP, thus providing full flexibility in application development. Using the FSP will ease migration of existing designs to the new RA8 Series devices.
“Our customers love the superior performance of the RA8 MCUs and are now looking for more feature optimized versions combined with high performance for their cost-sensitive industrial, vision AI and mid-end graphics applications,” said Daryl Khoo, Vice President of Embedded Processing 1st Business Division at Renesas. “The RA8E1 and RA8E2 deliver the right balance of performance and features for those markets and, with FSP, enable easy migration within the RA8 Series or from RA6 MCUs.”
Key Features of the RA8E1 MCUs
- Core: 360 MHz Arm Cortex-M85 with Helium and TrustZone
- Memory: 1MB Flash, 544 KB SRAM (including 32KB TCM w/ ECC, 512KB user SRAM with parity protection), 1KB standby SRAM, 32KB I/D caches
- Peripherals: Ethernet, XSPI (Octal SPI), SPI, I2C, USBFS, CAN-FD, SSI, ADC 12bit, DAC 12bit, HSCOMP, temperature sensor, 8-bit CEU, GPT, LP-GPT, WDT, RTC
- Packages: 100/144 LQFP
Key Features of the RA8E2 MCUs
- Core: 480 MHz Arm Cortex-M85 with Helium and TrustZone
- Memory: 1MB Flash, 672 KB SRAM (including 32KB TCM w/ ECC, 512KB user SRAM with parity protection+128 KB additional user SRAM), 1KB standby SRAM, 32KB I/D caches
- Peripherals: 16-bit external memory I/F, XSPI (Octal SPI), SPI, I2C, USBFS, CAN-FD, SSI, ADC 12bit, DAC 12bit, HSCOMP, temperature sensor, GLCDC, 2DRW, GPT, LP-GPT, WDT, RTC
- Packages: BGA 224
Winning Combinations
Renesas has combined the new RA8E1 and RA8E2 MCUs with numerous compatible devices from its portfolio to offer a wide array of Winning Combinations, including Entry Level Voice & Vision AI System and Human Machine Interface (HMI) for Appliances. These designs are technically vetted system architectures from mutually compatible devices that work together seamlessly to bring an optimized, low-risk design for faster time to market. Renesas offers more than 400 Winning Combinations with a wide range of products from the Renesas portfolio to enable customers to speed up the design process and bring their products to market more quickly. They can be found at renesas.com/win.
Availability
The RA8E1 and RA8E2 Group MCUs are available now, along with the FSP software. Renesas is also shipping a Fast Prototyping Board for the RA8E1 and will offer an RA8E2 Evaluation Kit including a TFT Display in early Q1 2025. More information is available at renesas.com/RA8E1 and renesas.com/RA8E2. Samples and kits can be ordered either on the Renesas website or through distributors.
Renesas MCU Leadership
A world leader in MCUs, Renesas ships more than 3.5 billion units per year, with approximately 50% of shipments serving the automotive industry, and the remainder supporting industrial and Internet of Things applications as well as data center and communications infrastructure. Renesas has the broadest portfolio of 8-, 16- and 32-bit devices, delivering unmatched quality and efficiency with exceptional performance. As a trusted supplier, Renesas has decades of experience designing smart, secure MCUs, backed by a dual-source production model, the industry’s most advanced MCU process technology and a vast network of more than 250 ecosystem partners. For more information about Renesas MCUs, visit renesas.com/MCUs.
About Renesas Electronics Corporation
Renesas Electronics Corporation (TSE: 6723) empowers a safer, smarter and more sustainable future where technology helps make our lives easier. A leading global provider of microcontrollers, Renesas combines our expertise in embedded processing, analog, power and connectivity to deliver complete semiconductor solutions. These Winning Combinations accelerate time to market for automotive, industrial, infrastructure and IoT applications, enabling billions of connected, intelligent devices that enhance the way people work and live. Learn more at renesas.com. Follow us on LinkedIn, Facebook, X, YouTube and Instagram.
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EEMBC’s CoreMark® benchmark measures performance of MCUs and CPUs used in embedded systems. |
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