FREMONT, Calif.--(BUSINESS WIRE)--ISE Labs, Inc., a leading provider of semiconductor engineering services, today announced the acquisition of a significant parcel of land within Axis 2 Industrial Park, located in Tonalá, a city and municipality within the Guadalajara Metropolitan Area. This strategic land purchase demonstrates the company’s long-term commitment to the state of Jalisco and establishes a footprint for future expansion.
ISE Labs focuses on semiconductor engineering, design and manufacturing scale-up of leading-edge semiconductor devices within North America and is a wholly owned subsidiary of ASE Technology Holding Company, the largest semiconductor assembly and test provider in the world. ASE plans for this project in Jalisco to include services for the packaging and testing of semiconductor chips, and believes it provides a unique opportunity for ASE to enlarge its global footprint and increase ASE’s presence in North America.
The future establishment of a semiconductor packaging and test facility in Jalisco paves the way for the recruitment of skilled engineers and technicians, and close collaboration with educational institutions on workforce development initiatives. The new facility is expected to create more than five hundred new jobs in its first year of operation.
To ensure the recruitment of the highly specialized talent required to operate in Jalisco, the Jalisco State Ministry of Economic Development (SEDECO), the Jalisco State Ministry of Innovation, Science and Technology (SICyT) and the Jalisco State Ministry of Education will facilitate a strong link between ISE Labs and the region's educational institutions and chambers of commerce.
Jalisco currently accounts for 70% of the semiconductor market in Mexico. The industry generates significant value in the economy due to the high paying jobs required to successfully run operations as well as the continued innovation across the state’s technology community.
“We are excited to strengthen ISE’s partnership with the state of Jalisco by securing future business expansion through our purchase of land in Tonalá. This proactive investment demonstrates ISE’s commitment to innovation, growth, and its valued relationship with the state of Jalisco,” said Kenneth Hsiang, Chief Executive Officer, ISE Labs. “It also provides business flexibility to expand as demand for semiconductor packaging and test continues to grow throughout North America.”
“This administration has successfully transformed our semiconductor and advanced electronics manufacturing services industry into a new model focused on technology and innovation,” said Enrique Alfaro Ramírez, Governor of the State of Jalisco. “ASE is a leading global company that represents the future and it has selected Guadalajara, Jalisco for this strategic investment that will bring important projects to our state. It also establishes Jalisco as the first state in Mexico, and indeed Latin America, that will offer OSAT services to major semiconductor companies from across North America.”
Terms of the acquisition have not been disclosed.
GLOSSARY
OSAT: Outsourced Semiconductor Assembly & Test
About ISE Labs, Inc.
Established in 1983, ISE Labs has a wealth of experience and expertise to serve the semiconductor community. The company’s broad offering of engineering services and products includes test engineering support, production test services, test program development, test interface and reliability test hardware, ESD, burn-in, environmental testing, mechanical testing, and failure analysis.
ISE Labs is a subsidiary of ASE, Inc. The world leader in advanced semiconductor packaging and test services, ASE offers a wide portfolio of technology and solutions for IC test program design, front-end engineering test, wafer probe, wafer bump, substrate design and supply, wafer level packaging, flip chip, system-in-package, and other manufacturing services.
About ASE, Inc.
Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711) is the leading global provider of semiconductor manufacturing services in packaging and test. Alongside a broad portfolio of established packaging and test technologies, ASE is also delivering innovative VIPack™, advanced packaging, and system-in-package solutions to meet growth momentum across a broad range of end markets, including AI, automotive, 5G, high-performance computing, and more. To learn about our advances in SiP, fanout, MEMS and sensor, flip chip, and 2.5D, 3D and TSV technologies, all ultimately geared towards applications to improve lifestyle and efficiency, please visit: aseglobal.com, or follow us on LinkedIn & X: @aseglobal