DUBLIN--(BUSINESS WIRE)--Research and Markets (http://www.researchandmarkets.com/research/s74ncb/mems_packaging_201) has announced the addition of the "MEMS Packaging 2012" report to their offering.
The MEMS packaging, assembly, test & calibration market will reach $2.3B value by 2016, growing three times faster than the overall IC packaging industry
MEMS PACKAGING MARKET IS GROWING FASTER THAN IC PACKAGING MARKET
In package unit shipments, the MEMS packaging market is growing 2x faster (- 20% CAGR) than what is predicted for the overall IC package market. WLP / TSV platform is set to grow the fastest while leadframe and organic laminate based packages are poised to grow a comfortable 16% CAGR over the next 5 years to come.
There are plenty of MEMS and sensors to be found in recent smartphone designs: MEMS accelerometers, gyroscopes, pressure sensors, electronic compass magnetometers, multiple silicon MEMS microphones, FBAR / BAW filters & duplexers, RF switches and MEMS oscillators: there is no doubt that MEMS content is growing faster than standard IC content.
KEY FEATURES OF THE REPORT
To provide market data on key MEMS packaging industry market metrics & dynamics
- Focus on key MEMS applications (including Silicon microphones, gyroscopes, accelerometers, magnetometers, fusion sensor combo units & IMU, pressure sensors, TPMS modules, micro-mirrors, micro-bolometers, oscillators & resonators, switches, FBAR/BAW filters, SAW filters, ink-jet MEMS modules, microfluidic & Biochips, micro-displays, micro-actuator auto-focus, etc)
- MEMS package and substrate unit shipments and revenues application by application
- Market shares for key MEMS player with detailed breakdown inside each MEMS applicative segment
To provide technical insight about key MEMS packaging technology trends & challenges
- From MEMS-ASIC integration trends (SiP module versus SOC) to interconnect trends (wire-bond versus flip-chip versus WLP / TSV) to substrate approach (ceramic, leadframe, organic laminate, silicon/glass interposers)
- Teardowns module analysis and reverse costing analysis of the main key MEMS package modules design wins from top tiers player leaders in their respective applicative market space
- Specific requirements in each MEMS packaging applications along with packaging technologies roadmaps
- Focus on final test and calibration trends which represent more than 20-30% of the total MEMS modules value
To provide a deep understanding of the MEMS packaging value chain, infrastructure & players
- Who are the key players (IDMs, fab-less, wafer foundries, packaging & test subcontractors) involved in the MEMS packaging business and how are they related?
- Where is the value in the MEMS packaging, assembly, test & calibration area depending on each application? How this value is shared among the different business models in this space and how does this value flows?
WHO SHOULD BUY THE REPORT?
Assembly & test service packaging subcontractors (OSATs)
- Understand the MEMS packaging industry market dynamics and its key future applications
- Get the list of today's and tomorrow key MEMS players to drive your business
- Understand the key MEMS modules cost structures through explicit teardown analysis
- Plan ahead for needed investments capacity related to this field
MEMS IDM's (Integrated Device Manufacturers) and fabless companies
- Get the list of the top assembly, packaging & test packaging subcontractors active in the MEMS packaging business
- Benchmark competition activity and choose the right package and partner for your future MEMS module applications
Substrate suppliers
- Understand the differentiated value of your products and technologies in the MEMS market
- Evaluate your related TAM Total Accessible Market' in this market
- Get the list of today's and tomorrow key MEMS players to drive your business
MEMS and CMOS wafer foundries
- Spot new opportunities and define diversification strategies, especially related to the MEMS Wafer-Level-Packaging opportunity (with wafer bonding, TSV, RDL and bumping features)
Electronic module makers and OEMs
- Evaluate the benefits of using these new technologies in your end system
- Monitor new application and package trends
For more information visit http://www.researchandmarkets.com/research/s74ncb/mems_packaging_201