MINNEAPOLIS--(BUSINESS WIRE)--FSI International, Inc. (Nasdaq: FSII) announced today that a leading global device producer has placed a follow-on order for multiple ANTARES® CryoKinetic Cleaning Systems. The chip provider currently uses the ANTARES® System for various particle removal processes and with these orders, is adding capacity for advanced technology generations. The systems are expected to ship in fiscal 2012.*
The ANTARES® System is a fully automated, single-wafer, CryoKinetic system used for processing 200/300mm wafers with capabilities to remove nanoscale particles. CryoKinetic processing technology is an all-dry, chemical free process that removes particles through impact by high-velocity cryogenic Ar/N2 aerosol, and reduces defects without damaging the wafer surface, even on copper and porous low-k films. The system’s highly efficient dry cleaning solution can be used for a variety of particle removal applications in FEOL and BEOL. Many of the leading logic device manufacturers worldwide utilize the ANTARES® System for its defect reduction and yield improvement benefits at 32/28nm and above technology nodes.
FSI International, Inc. is a global supplier of surface conditioning equipment, technology and support services for microelectronics manufacturing. Using the company’s broad portfolio of cleaning products, which include batch and single-wafer platforms for immersion, spray and cryogenic aerosol technologies, customers are able to achieve their process performance flexibility and productivity goals. The company’s support services programs provide product and process enhancements to extend the life of installed FSI equipment, enabling worldwide customers to realize a higher return on their capital investment. For more information, visit FSI’s website at http://www.fsi-intl.com.
“Safe Harbor” Statement Under the Private Securities Litigation
Reform Act of 1995
This press release contains certain
“forward-looking” statements (*), including, but not limited to expected
shipment of the ANTARES® Systems in fiscal 2012. Except for
the historical information contained herein, the matters discussed in
this news release are forward-looking statements involving risks and
uncertainties, both known and unknown, that could cause actual results
to differ materially from those in such forward-looking statements. Such
risks and uncertainties include, but are not limited to, changes in
industry conditions; order delays or cancellations; general economic
conditions; changes in customer capacity requirements and demand for
microelectronics; the extent of demand for the company’s products and
its ability to meet demand; global trade policies; worldwide economic
and political stability; the company’s successful execution of internal
performance plans; the cyclical nature of the company’s business;
volatility of the market for certain products; performance issues with
key suppliers and subcontractors; the level of new orders; the timing
and success of current and future product and process development
programs; the success of the company’s direct distribution organization;
legal proceedings; the potential impairment of long-lived assets; and
the potential adverse financial impacts resulting from declines in the
fair value and liquidity of investments the company presently holds; the
impact of natural disasters on parts supply and demand for products; the
ability to attract, retain and motivate a sufficient number of qualified
employees; as well as other factors listed herein or from time to time
in the company’s SEC reports, including our latest 10-K annual report.
The company assumes no duty to update the information in this press
release.