Research and Markets: Power Fab Database 2011 - Exhaustive Database of 340+ Worldwide Power Electronics Players

DUBLIN--(BUSINESS WIRE)--Research and Markets (http://www.researchandmarkets.com/research/45db08/power_fab_database) has announced the addition of the "Power Fab Database 2011" directory to their offering.

Exhaustive database of 340+ worldwide power electronics players

Our power fab database is a unique tool providing a complete overview of all power electronics manufacturers in the world. We included the most exhaustive information concerning worldwide manufacturers, including Chinese and Eastern Europeans, with production type, status and capacity.

In an Excel format including stats & graphs, the database allows a complete customization of market and technology analysis. This database is a unique tool for business & marketing managers, institutions & investors and system manufacturers of the power electronics community.

KEY FEATURES

The power fab database provides for the 340+ entries informations on:

• Company and mother company
• Fab details (name - address - country area - phone/fax - website - region - area)
• Fab type (front-end, back-end)
• Clean room details (size, class, construction and equipment cost and year)
• Process technology (bipolar, BICMOS, BCD, CMOS)
• Maximum voltage
• Substrate material (Si, SiC, Sapphire, GaAs, GaN, SOI)
• Company contact (name - position - e-mail - phone)
• Type of devices (MOSFET, IGBT, Thyristor/SCR/GTO, BJT, Diodes, Power IC, IPM, Power modules, Other FET)
• Wafer characteristics (FZ/CZ, geometry, size, active layer)
• Production capacity in wafers per month

GET THE REAL PICTURE OF TODAY POWER ELECTRONICS MANUFACTURING

Data presented are the most up-to-date information, collected through a large amount of contacts, publications and exhibitions we have access to.

Key Topics Covered:

Fab Coordonates

Fab Characteristics

• Fab name
• Back-end
• Front-end
• Status
• Year
• Cost of acquisition
• Equipment cost
• Construction cost
• Clean Room class
• Clean room Sq Ft
• Wafers/month fully ramped

Product Power category

• MOSFET
• IGBT
• Thyristor/SCR/GTO/IGCT
• BJT
• Other FET
• Diodes
• Power IC
• IPM
• Power Modules

Technology

• Maximum Voltage
• Bipolar
• BiCMOS
• CMOS
• BCD

Substrate material

• Silicon
• SiC
• Sapphire
• GaAs
• GaN
• SOI

Wafer Characteristics

• Silicon Wafer Types
• Geom
• Waf Sze
• Active layer

Contact

• Name
• First name
• Title
• Position
• E-mail
• Phone

For more information visit http://www.researchandmarkets.com/research/45db08/power_fab_database