YOKOHAMA, Japan & SAN JOSE, Calif.--(BUSINESS WIRE)--Apache Design Solutions, providing the industry’s leading power and noise solutions for Chip-Package-System (CPS) convergence, responded to the demands of a growing customer base by launching a Japanese language website and by adding E&E Public Relations, Inc., a leading technology focused public relations firm in Japan.
The new Japanese website will provide easy access for customers to learn more about Apache’s broad offering of products and solutions, and the addition of a Japan-based PR agency will help to provide better representation of the company’s news and announcements.
“The addition of a Japanese language website and PR agency further underscores the company’s deep commitment to serve its customers and the growing Japanese marketplace,” said Dian Yang, Apache’s executive vice president and general manager of Asia. “This expansion helps reinforce the Apache Design Solutions KK operations in serving our customer base across broad application segments for our leading power, noise, and reliability solutions.”
Apache Design Solutions will be exhibiting in booth #101 at the upcoming Electronic Design and Solutions Fair (EDSF) being held on January 27-28, 2011, at the Pacifico Yokohama Exhibition Hall in Japan. The company will showcase its industry leading products for power reduction and power-induced noise management, along with its ultra-low power and CPS flows encompassing all of Apache’s products including PowerArtist, RedHawk, Totem, Sentinel, and PathFinder. Apache will also be a featured panelist at the co-located Asia South Pacific Design Automation Conference (ASP-DAC) Designers’ Forum, 5D (Panel Discussion) titled C-P-B Co-design/Co-verification Technology for DDR3 1.6G in Consumer Products, on Thursday, January 27, 2011, from 13:40-15:40. Along with Apache, the informative panel session will feature speakers from ASE, Global Unichip, Sony, and Toshiba.
About Apache Design Solutions
Apache delivers the industry’s leading power and noise solutions for chip-package-system convergence from RTL to sign-off. Apache's innovative platforms address the unique power and noise challenges associated with specific design domains such as digital, analog and mixed-signal, IC package and PCB, while providing a co-analysis environment that integrates the SoC, custom IP, and System worlds. From RTL power analysis and reduction, to early stage prototyping and optimization, and through chip and package sign-off, Apache’s products enable designers to lower power consumption, increase operating performance, reduce system cost, and mitigate design risks. Apache is a global company with R&D centers and direct sales and support offices worldwide and their products are adopted by all of the top semiconductor companies.
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