ORLANDO, Fla.--(BUSINESS WIRE)--Laser Photonics Corporation (NASDAQ: LASE) (“LPC” or “the Company”), a leading global developer of industrial laser systems for cleaning and other material processing applications, announced today the expansion of its product offering targeting the surging market for chip fabrication.
The growing demand for electronics and electric vehicles, the rise of industrial automation, and the adoption of AI by technologies across all areas are just some factors that are propelling the chip design and fabrication market forward. Indeed, some analysts expect the semiconductor market to reach an annual $1 trillion by 2030 on the global scale. Yet, although global supply chains have largely recovered from the COVID-19 pandemic, challenges persist as they struggle to fulfill the high demand for advanced chips. That is why the adoption of high-speed laser processing equipment by chip fabs is more essential than ever.
LPC is providing this laser-powered technology to help accelerate the manufacturing of semiconductors. For the Company, established as a trusted provider of industrial laser equipment for surface preparation, cutting, marking, and welding, chip fabrication has been one of the target sectors. Now, joined by its recently acquired subsidiary, Control Micro Systems, Inc. (CMS), LPC has expanded its product line of advanced laser wafer dicing, marking, and scribing technologies.
One of LPC’s flagship products in this space is the BlackStar laser wafer dicing and scribing system. Engineered with short-pulse laser technology, die singulation by the BlackStar involves minimal heat and does not require water jet cooling to separate brittle materials like silicon. This technique greatly improves die yield while minimizing the need for individual die processing, in turn reducing time and labor.
LPC’s expanded portfolio of products for the semiconductor industry now also includes custom-tailored multi-station laser systems for wafer marking, scribing, and lapping, built to handle a variety of wafer thicknesses and sizes. This innovative technology features robotic wafer positioning and machine vision, and serves to facilitate the production and tracing of chips. Separately, a chip marking system integrating ultraviolet laser technology has been added to its portfolio, which allows for the production of the smallest permanent chip markings without damage to the surrounding microstructure of the die.
“Our growth is fueled by the addition of CMS, and we are excited to expand our product portfolio and offer high-speed, effective laser equipment to chip fabs,” said Wayne Tupuola, CEO of LPC. “We are continuously driven by our mission to upgrade industrial material processing with reliable laser technology. For the semiconductor manufacturing sector, where progress is critical today, we provide automated solutions that greatly optimize the processing of silicon and related brittle materials.”
For more information, visit the LPC website at www.laserphotonics.com.
About Laser Photonics Corporation
Laser Photonics is a vertically integrated manufacturer and R&D Center of Excellence for industrial laser technologies and systems. Laser Photonics seeks to disrupt the $46 billion, centuries-old sand and abrasives blasting markets, focusing on surface cleaning, rust removal, corrosion control, de-painting and other laser-based industrial applications. Laser Photonics’ new generation of leading-edge laser blasting technologies and equipment also addresses the numerous health, safety, environmental and regulatory issues associated with old methods. As a result, Laser Photonics has quickly gained a reputation as an industry leader in industrial laser systems with a brand that stands for quality, technology and product innovation. Currently, world-renowned and Fortune 1000 manufacturers in the aerospace, automotive, defense, energy, maritime, nuclear and space industries are using Laser Photonics’ “unique-to-industry” systems. For more information, visit https://www.laserphotonics.com.
Cautionary Note Concerning Forward-Looking Statements
This press release contains “forward-looking statements” (within the meaning of Section 27A of the Securities Act of 1933, as amended, and Section 21E of the Securities Exchange Act of 1934, as amended), including statements regarding the Company’s plans, prospects, potential results and use of proceeds. These statements are based on current expectations as of the date of this press release and involve a number of risks and uncertainties, which may cause results and uses of proceeds to differ materially from those indicated by these forward-looking statements. These risks include, without limitation, those described under the caption “Risk Factors” in the Registration Statement. Any reader of this press release is cautioned not to place undue reliance on these forward-looking statements, which speak only as of the date of this press release. The Company undertakes no obligation to revise or update any forward-looking statements to reflect events or circumstances after the date of this press release except as required by applicable laws or regulations.
