LAS VEGAS--(BUSINESS WIRE)--TDK Corporation (TSE: 6762) announces the T5818 Pulse Density Modulation (PDM) microphone with a dynamic range of 107dB at 590µA, the widest dynamic range in the industry at the lowest power. This allows for excellent acoustic performance in environments that shift from very quiet to very loud, such as far field voice pickup barge-in for Smart Speaker applications.
The T5818 microphone features 66dBA SNR, 135dB SPL AOP, at 590 µA in High Quality Mode (HQM), and decreases power consumption to 215 µA in Low Power Mode (LPM). This microphone is essential for capturing high quality audio inputs, which plays a vital role for AI engines and cloud-based applications that require a PDM microphone interface. Current analog output wide dynamic range microphones require expensive ADCs to take advantage of full acoustic capabilities. The T5818 provides this ADC conversion while maintaining excellent dynamic range with the benefits of a PDM low latency bit stream. This makes the T5818 suitable for a wide range of applications, from mobile phones to ANC headsets.
“We are very excited about the advances in PDM performance included in the T5818,” said Hiro Hayashi, Vice President, Audio, InvenSense, a TDK Group Company. “This microphone compliments our market leading analog portfolio, solidifying TDK’s performance leadership in MEMS microphone technology.”
TDK will be demonstrating the T5818 microphone along with the industry’s most comprehensive portfolio of passive components, sensors, power supplies and batteries in its booth #11448 at CES, Central Hall (LVCC), Las Vegas Convention Center, January 7-10, 2020 in Las Vegas, Nevada. T5818 is currently in mass production and will be available through distribution in Q1 2020. For samples and additional information, please contact sales@invensense.com or visit www.invensense.com.
Glossary
- HQM: High Quality Mode
- LPM: Low Power Mode
- AOP: Acoustic Overload Point
Main applications
- Smartphones
- Microphone Arrays
- Tablets
- Cameras
- Bluetooth Headsets
- Notebook PCs
- Security and Surveillance
Key features
- 3.5 × 2.65 × 0.98 mm surface‐mount package
- Low power: 215 µA in Low‐Power Mode
- Extended frequency response from 40 Hz to >20 kHz
- Sleep Mode: 8 µA
- High power supply rejection (PSR): −98 dB FS
- Fourth‐order Σ‐Δ modulator
- Digital pulse density modulation (PDM) output
- Compatible with Sn/Pb and Pb‐free solder processes
- RoHS/WEEE compliant
Key data
Product |
Packaging Dimensions (mm) |
SNR dBA |
Acoustic Overload Point dB SPL |
Low Power Mode µA |
Bandwidth kHz |
Low Frequency Corner Hz |
Digital Interface |
T5818 |
3.50 × 2.65 × 0.98 |
66 |
135 |
215 |
20 |
40 |
PDM |
About TDK Corporation
TDK Corporation is a leading electronics company based in Tokyo, Japan. It was established in 1935 to commercialize ferrite, a key material in electronic and magnetic products. TDK's comprehensive portfolio features passive components such as ceramic, aluminum electrolytic and film capacitors, as well as magnetics, high-frequency, and piezo and protection devices. The product spectrum also includes sensors and sensor systems such as temperature and pressure, magnetic, and MEMS sensors. In addition, TDK provides power supplies and energy devices, magnetic heads and more. These products are marketed under the product brands TDK, Chirp, EPCOS, InvenSense, Micronas, Tronics and TDK-Lambda. TDK focuses on demanding markets in the areas of information and communication technology and automotive, industrial and consumer electronics. The company has a network of design and manufacturing locations and sales offices in Asia, Europe, and in North and South America. In fiscal 2019, TDK posted total sales of USD 12.5 billion and employed about 105,000 people worldwide.
About InvenSense
InvenSense, Inc., a TDK Group company, is a world leading provider of MEMS sensor platforms. InvenSense’s vision of Sensing Everything® targets the consumer electronics and industrial areas with integrated Motion, Sound, and Ultrasonic solutions. InvenSense’s solutions combine MEMS (micro electrical mechanical systems) sensors, such as accelerometers, gyroscopes, compasses, microphones, and ultrasonic 3D-sensing with proprietary algorithms and firmware that intelligently process, synthesize, and calibrate the output of sensors, maximizing performance and accuracy. InvenSense’s motion tracking, ultrasonic, audio, fingerprint, location platforms and services can be found in Mobile, Wearables, Smart Home, Industrial, Automotive, and IoT products. InvenSense became part of the MEMS Sensors Business Group within the newly formed Sensor Systems Business Company of TDK Corporation in 2017. In February of 2018, Chirp Microsystems joined the InvenSense family through its acquisition by TDK. InvenSense is headquartered in San Jose, California and has offices worldwide. For more information, go to www.invensense.com.
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Further information on the products can be found under https://www.invensense.tdk.com/technology/sound/
