DUBLIN--(BUSINESS WIRE)--The "Thermal Management Market by Material (Adhesives, Nonadhesive), Device (Conduction, Convection, Advanced, and Hybrid), Thermal Management Service, End-Use Industry, and Region - Global Forecast to 2024" report has been added to ResearchAndMarkets.com's offering.
The thermal management market is projected to reach USD 16.2 billion by 2024, at a CAGR of 7.8% between 2019 and 2024.
This report covers key end-use industries such as consumer electronics, automotive, servers & data centers, healthcare, and aerospace & defense wherein thermal management solutions and systems are used. The consumer electronics segment accounted for the largest share of 25.5% of the thermal management market in 2018.
This segment comprises laptops & desktops, audio amplifier components, power supply units, and gaming devices. These devices generate a significant amount of heat. Improper dissipation of this heat can damage components of systems leading to their malfunctioning. Therefore, extensive use of thermal management unit interfaces is required in consumer electronics to ensure their optimal operations.
Thermal management is a process that uses thermodynamics and heat transfer technologies to control the temperature of systems. It uses heat transfer, conduction, convection, condensation, and radiation principles to regulate and distribute heat in different systems. Thermal management involves generation, control, and dissipation of heat in electronic devices and systems. The demand for miniature devices and power computing devices is increasing at a significant rate across the globe.
This has led to the requirement for improved and efficient thermal management to ensure the optimal operating temperature of electronic devices. Proper heat dissipation improves the operational efficiency of electronic devices, thereby increasing their life. The advent of flexible electronics and the advancements taking place in chip stack architecture have also generated the demand for thermal management.
Key players in the thermal management market include Honeywell International Inc. (US), Aavid Thermalloy LLC. (US), Vertiv Co. (US), European Thermodynamics Ltd. (UK), and Master Bond Inc. (US), among others.
These key market players have adopted product launches & developments, expansions, and partnerships as key strategies to increase their market share and maintain a strong foothold in the thermal management market.
Other companies operating in the market include Advanced Cooling Technologies, Inc. (US), Dau Thermal Solutions Inc. (US), Amerasia International Technology Inc. (US), Heatex AB (Sweden), LORD Corporation (US), Parker Chomerics (US), Laird PLC (UK), Henkel AG & Company, KGaA (Germany), and Delta Electronics, Inc. (Taiwan).
Key Topics Covered:
1 Introduction
2 Research Methodology
3 Executive Summary
4 Premium Insights
5 Market Overview
5.1 Introduction
5.2 Market Dynamics
5.2.1 Drivers
5.2.2 Restraints
5.2.3 Opportunities
5.2.4 Challenges
5.3 Value Chain Analysis
6 Thermal Management Market, By Materials
6.1 Introduction
6.2 Adhesive Materials
6.2.1 Tapes
6.2.2 Films
6.2.2.1 Thermally Conductive
6.2.2.2 Electronically Conductive
6.2.3 Adhesive Liquids
6.2.3.1 Heat Cure
6.2.3.2 Room Temperature Cure
6.3 Non-Adhesive Materials
6.3.1 Pads
6.3.1.1 Electrically Insulating (if data available)
6.3.1.2 Non Electrically insulating (if data available)
6.3.2 Gap Fillers
6.3.3 Phase Change Materials
6.3.4 Greases
7 Thermal Management Market, By Devices
7.1 Introduction
7.2 Conduction Cooling Devices
7.2.1 Wedge locks
7.2.2 Potting
7.3 Convection Cooling Devices (passive and active)
7.3.1 Heat Sink
7.3.2 Heat Spreaders
7.3.3 Forced Air and Natural Cooling Devices
7.3.4 Heat Pumps
7.4 Advanced Cooling Devices
7.4.1 Direct Immersion Cooling
7.4.2 Microchannel Cooling
7.4.3 Cold Plates
7.4.4 Other (Cryogenic Cooling, Refrigerant Cooling, and Spray Cooling)
7.5 Hybrid Cooling Devices
7.5.1 Electrowetting
7.5.2 Spot Coolers
7.5.3 Vapour Chambers
7.5.4 Compact Heat Exchangers
7.5.5 Thermoelectric Cooling
7.5.6 Other (Jet impingement cooling, Heat superconductors)
8 Thermal Management Market, By Service
8.1 Introduction
8.2 Installation and Calibration
8.3 Optimization and Post-Sales Support
9 Thermal Management Market, By End-Use Application
9.1 Aerospace & Defense
9.2 Automotive
9.2.1 Battery Thermal Management
9.2.1.1 Hybrid Vehicle
9.2.1.2 Plug-In Electric Vehicle
9.2.2 Engine Control Thermal Management
9.2.3 Waste Heat Recovery and Emissions Reduction
9.2.4 Brake and Suspension Cooling Systems
9.2.5 Seat Heating and Cooling
9.2.6 Automotive LED Lighting System
9.3 Servers and Data Centers
9.4 Consumer Electronics
9.4.1 Laptop and Computer
9.4.2 Audio amplifier components
9.4.3 Home Appliances (TV, Fridge, Washing Machine, Blender, Oven, etc.)
9.4.4 Power supplies
9.4.5 Gaming Devices
9.4.6 Mobile phones
9.5 Healthcare
9.5.1 Large Infrastructure Equipment
9.5.2 Portable Equipment
10 Thermal Management Market, Geographic Analysis
Company Profiles
- Aavid Thermalloy
- Advanced Cooling Technologies
- Amerasia International (AI) Technology
- API Heat Transfer
- Danfoss
- DAU Thermal Solutions
- Delta Electronics
- European Thermodynamics
- Gentherm
- Heatex AB
- Henkel AG
- Honeywell International
- Jaro Thermal
- Kelvion Holdings
- Laird
- LORD CORP.
- Master Bond
- Parker (Chomerics)
- Thermotek Inc.
- Vertiv Co.
For more information about this report visit https://www.researchandmarkets.com/r/uwjug3
