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Morse Micro Announces MM8108-M20 High-Power Wi-Fi HaLow Module to Accelerate Long-Range IoT Adoption

SYDNEY--(BUSINESS WIRE)--Morse Micro launches the MM8108-M20, a high-power Wi-Fi HaLow module for faster long-range IoT product development....
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Power Integrations推出节省空间的超薄型辅助电源参考设计,适用于NVIDIA的Kyber 800VDC AI数据中心应用

中国台湾台北--(BUSINESS WIRE)--(美国商业资讯)-- 台北国际电脑展(COMPUTEX)讯 – 深耕于高压集成电路高能效功率变换领域的知名公司Power Integrations(纳斯达克股票代号:POWI)今日推出两款全新超薄紧凑型辅助电源参考设计,专为800VDC AI数据中心打造。其中一款单路输出15W设计的尺寸仅为30mm×30mm,厚度为7mm;另一款隔离式、六路输出、35W设计的尺寸仅为80mm×60mm,厚度为8mm。这两款超紧凑型设计方案专为NVIDIA的Kyber液冷刀片式机架架构优化设计,可在布局密集的主配电板(PDB)上节省约30%空间,同时BOM元件数预计减少30%,进而简化设计并提升整体可靠性。这两款设计效率极高,在整个输入电压和负载范围内,效率均不低于88%。 Power Integrations高级培训经理Jason Yan表示,“Power Integrations是率先推出单HEMT 1700V GaN器件的公司,因此能够打造这款业界顶尖、高能效的反激式电源。该方案物料清单精简,同时可在800V母线电压下保持充足的安全裕量。市面上其他...
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Power Integrations推出節省空間的超薄型輔助電源參考設計,適用於輝達Kyber 800VDC AI資料中心應用

台北--(BUSINESS WIRE)--(美國商業資訊)-- 台北國際電腦展 (COMPUTEX)訊 – 深耕於高壓集成電路高效能功率轉換領域的知名企業Power Integrations(納斯達克代碼:POWI)今日推出兩款全新超薄緊湊型輔助電源參考設計,專為800VDC AI資料中心打造。其中,單路輸出15W實際的尺寸僅有30mm×30mm,厚度為7mm;另一款六路輸出、35W設計的尺寸僅有80mm×60mm,厚度為8mm。這兩款超薄電源專為輝達(NVIDIA)的Kyber液冷刀片式機架架構設計,可在佈局緊密的主配電盤 (PDB)上節省約30%空間,同時BOM零件數估計減少30%,進而簡化設計並提升整體可靠性。這兩款設計的效率極高,在整個輸入電壓和負載範圍內,效率均不低於88%。 Power Integrations資深培訓經理Jason Yan說:「 Power Integrations是率先推出單HEMT 1700V GaN元件的公司,因此能夠打造這款業界頂尖、高效能的返馳式電源。它的物料清單簡潔,同時可以在800V母線電壓下保持充足的安全裕度。市面上其他的替代方案均採用分立...
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Power Integrations Unveils Space-Saving, Ultra-Slim Auxiliary PSU Reference Designs for NVIDIA Kyber 800 VDC AI Data Center

TAIPEI, Taiwan--(BUSINESS WIRE)--COMPUTEX – Power Integrations (NASDAQ: POWI), the leader in high-voltage integrated circuits for energy-efficient power conversion, today introduced two new ultra-slim, compact auxiliary power supply reference designs for 800 VDC AI data centers. The single-output, 15 W design is only 30 mm by 30 mm with a 7 mm profile, while the isolated, six-rail, 35 W design is only 80 mm by 60 mm with an 8 mm profile. Optimized specifically for the NVIDIA Kyber liquid-cooled...
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FPT and UOB Sign MoU to Advance AI, Technology Transformation and Financial Innovation

SINGAPORE--(BUSINESS WIRE)--Global technology corporation FPT and UOB have signed a Memorandum of Understanding (MoU) to explore strategic collaboration opportunities in AI, digital transformation, and financial services innovation. The MoU exchange ceremony took place at the Vietnam - Singapore Tech Connect Forum during the General Secretary of the Communist Party of Viet Nam and State President H.E. To Lam’s official visit to Singapore. Under the MoU, the collaboration will span a broad set o...
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Ventiva Partners with ASUS to Explore Next-Generation Thermal Architectures for Compact AI Computing Systems

TAIPEI, Taiwan--(BUSINESS WIRE)--Ventiva®, a leader in solid-state cooling solutions, today announced at Computex 2026 a strategic partnership with ASUS to explore next-generation thermal architectures for compact AI computing systems. Through this collaboration, the companies will evaluate how Ventiva's ionic cooling technology can support future ASUS NUC and Mini-PC designs. As AI workloads demand more processing power in increasingly constrained form factors, thermal management has emerged a...
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Mobvista (1860.HK) Delivers Solid 2026 Q1 Performance Fueled by AI-Driven Advertising

SINGAPORE--(BUSINESS WIRE)--Mobvista (1860.HK), a leading technology platform providing global growth solutions, today announced its financial results for the quarter ended March 31, 2026. During the reporting period, the Group delivered solid revenue growth and profitability: Group revenue reached $581.3 million, representing a year-on-year increase of 32.2%. Gross profit grew 26.9% year-over-year, reaching $121.9 million. Adjusted EBITDA increased 12.0% year-over-year, hitting $46.7 million....
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Best’s Market Segment Report: Japan Life Insurers’ Use of Reinsurance More Than Doubled Since 2020

HONG KONG--(BUSINESS WIRE)--Japan’s life insurers have increasingly relied on reinsurance in recent years, with the overall cession rate as a percentage of total gross premium written for the segment rising to more than 24% in 2023 and 2024 from just under 10% in 2020, according to a new AM Best report. According to the new Best’s Special Report, “Japan Life Insurers Increase Use of Reinsurance,” the implementation of an economic value-based solvency regulation framework is driving the increase...
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Faraday Future Founder and Global CEO YT Jia Shares Weekly Investor Update: Total Sales and Shipments of EAI Robots Reached 69 Units in May, a New Record, Exceeding the Combined Total for the Months of March and April

LOS ANGELES--(BUSINESS WIRE)--Faraday Future Intelligent Electric Inc. (NASDAQ: FFAI) (“Faraday Future”, “FF” or the “Company”), a California-based global Embodied AI (EAI) ecosystem company, today shared a weekly business update from YT Jia, Founder and Global CEO of FF. “Welcome to Issue 57 of our weekly report. In the final week of May, we would like to highlight two pieces of good news: first, total sales and shipments of EAI robots reached 69 units in May, exceeding the combined total for...
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Fortegra completa l'acquisizione da parte di DB Insurance

JACKSONVILLE, Fla.--(BUSINESS WIRE)--The Fortegra Group, Inc. ("Fortegra"), compagnia globale di assicurazioni specializzate, oggi ha annunciato il completamento della sua acquisizione da parte di DB Insurance Co., Ltd. ("DB"), uno dei principali assicuratori del ramo danni in Corea. L'operazione, annunciata il 26 settembre 2025, ha ricevuto tutte le approvazioni normative e degli azionisti. Fortegra opererà in maniera indipendente, mantenendo il suo team dirigente esistente, i rapporti di dist...