DUBLIN--(BUSINESS WIRE)--The "Asia Pacific Wi-Fi Module Market Analysis (2018-2024)" report has been added to ResearchAndMarkets.com's offering.
The Asia Pacific Wi-Fi Module Market is expected to witness market growth of 12.4% CAGR during the forecast period (2018 - 2024).
A Wi-Fi module is an independent system on a chip (SoC), integrated using TCP/IP stack, which provide access to the Wi-Fi networks. Adoption of cloud computing and rapid growth in telecommunication, residential, and commercial sectors are contributing to the growth of the market. However, privacy and security issues is expected to limit the market growth significantly.
Based on Type, the market is segmented into Router Scheme and Embedded. Based on Application, the market is segmented into Smart Grid & Smart Appliance, Handheld Mobile Device, Medical & Industrial Testing Instrument, and Others. Based on countries, the Wi-Fi Module market segments the market into China, Japan, India, South Korea, Singapore, Malaysia, and Rest of Asia Pacific.
Companies Mentioned
- Murata Manufacturing Co., Ltd.
- Microchip Technology Incorporated
- Taiyo Yuden Co., Ltd.
- AzureWave Technologies, Inc.
- Silicon Laboratories, Inc.
- Laird PLC
- BroadLink
-
Advantech Co., Ltd.
- Shanghai MXCHIP Information Technology Co., Ltd.
- Silex Technology, Inc.
Key Topics Covered:
Chapter 1. Market Scope & Methodology
Chapter 2. Market Overview
Chapter 3. Asia Pacific Wi-Fi Module Market
Chapter 4. Asia Pacific Wi-Fi Module Market by Application
Chapter 5. Asia Pacific Wi-Fi Module Market by Country
Chapter 6. Company Profiles
For more information about this report visit https://www.researchandmarkets.com/research/z7fszs/asia_pacific?w=4
