TOKYO--(BUSINESS WIRE)--Toshiba Electronic Devices & Storage Corporation has added "TCB001FNG", a new surface-mount product, to its line-up of 4-channel power IC. Based on IC achievements for car audio secured over many years, the new power IC is configured with a pure complementary MOS process. Mass production starts today.
Like current products[1], the new IC uses Toshiba Electronic Devices & Storage Corporation’s original filtering technology to detect and suppress high frequency noise from sources as diverse as mobile phones and electric door mirrors.
The package is a flat type HSSOP, which allows surface mounting. In conventional car audio IC products, a lead insertion type of HZIP package is widely used. However, recent years have seen the promotion of surface mount type packages, particularly in the market of genuine products. Adoption of surface mount package, securely positioned with reflow soldering, increases system reliability and the performance of car audio.
Main specifications of new product |
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Part Number | TCB001FNG | |
Maximum output | 45Wx4ch (VDD=15.2V,RL=4Ω, MaxPower) | |
Supply voltage | 6V to 18V | |
Output offset voltage | 90mV | |
Output noise voltage | 55µV (BW=DIN_AUDIO) | |
Internal peripheral |
•High sound quality, low distortion •Built-in mute and standby switch function, offset detection, and short detection
•6V operations •Built-in protection circuits (thermal shutdown, overvoltage, short to Vcc, short to GND, and output to output short) |
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Package | P-HSSOP36-1116-0.65-001 | |
Price | 500 yen(tax included) | |
Note:
[1] TCB001HQ
For more information about the new product, please visit:
https://toshiba.semicon-storage.com/info/lookup.jsp?pid=TCB001FNG®ion=jp&lang=ja
Customer inquiries:
Mixed Signal IC Sales and Marketing
Department
Sales and Marketing Group I
Tel: +81-44-548-2826
https://toshiba.semicon-storage.com/ap-en/contact.html
* Information in this document, including product prices and specifications, content of services and contact information, is current on the date of the announcement but is subject to change without prior notice.
About Toshiba Electronic Devices & Storage Corporation
Toshiba
Electronic Devices & Storage Corporation combines the vigor of a new
company with the wisdom of experience. Since being spun off from Toshiba
Corporation in July 2017, we have taken our place among the leading
general devices companies, and offer our customers and business partners
outstanding solutions in discrete semiconductors, system LSIs and HDD.
Our 19,000 employees around the world share a determination to maximize
the value of our products, and emphasize close collaboration with
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billion) and to contributing to a better future for people everywhere.
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