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HOUSTON & TAIPEI, Taiwan--(BUSINESS WIRE)--COMPUTEX – HPE (NYSE: HPE) today announced the expansion of its industry-leading server portfolio with the introduction of the HPE ProLiant Compute DL394 Gen12, powered by NVIDIA Vera CPU. This next-generation server is engineered specifically to address the compute demands of emerging high-performance AI and data processing workloads delivering industry-leading agentic AI CPU performance, memory bandwidth, and low latency. Built on a foundation of adv...

BREMEN--(BUSINESS WIRE)--Synera, die agentische KI-Plattform für die gesamte Wertschöpfungskette der Produktentwicklung, ist eines der ersten Unternehmen im Bereich Design und Simulation, das mit NVIDIA NemoClaw zusammenarbeitet. NemoClaw ist ein Blueprint zur Entwicklung spezialisierter KI-Agenten, die lang andauernde Engineering-Workflows sicher, zuverlässig und im Enterprise-Maßstab ausführen können. Mit diesem Meilenstein reiht sich Synera in eine ausgewählte Gruppe von Softwareunternehmen...

BREMEN, Germany--(BUSINESS WIRE)--Synera's collaboration with NVIDIA highlights the growing role of agentic AI in transforming physical product development....

SAN JOSE, Calif.--(BUSINESS WIRE)--At Computex 2026, Cadence (Nasdaq: CDNS) announced the industry’s first fully autonomous virtual agentic AI design engineer, extending the ChipStack™ AI Super Agent to Level-5 autonomy. Built on Cadence’s AI-driven electronic design automation (EDA) portfolio with NVIDIA Nemotron models, and secured by NVIDIA OpenShell runtime, the new agentic capabilities enable customers to run dynamic simulations in automated workflows. At NVIDIA, 1000s of engineers are usi...

EINDHOVEN, Netherlands--(BUSINESS WIRE)--Invisix, the semiconductor metrology company developing next-generation measurement tools for advanced chip manufacturing, has raised an oversubscribed €20 million seed round, which includes Hitachi Ventures, Transition Ventures, imec.xpand, Doosan Investment Co., and a tier-1 semiconductor manufacturer. The funding will be used to grow the Invisix team, accelerate development of its first shippable system, and support customer demonstrations at a new cl...

SOUTH SAN FRANCISCO, Calif.--(BUSINESS WIRE)--Genentech, a member of the Roche Group (SIX: RO, ROP; OTCQX: RHHBY), announced today that new data from its obesity portfolio will be presented at the 2026 Scientific Sessions of the American Diabetes Association® (ADA). The insights demonstrate significant progress in addressing a range of unmet needs for people living with obesity or overweight such as long-term treatment adherence, which could be supported by a favorable safety and tolerability p...

KYOTO, Japan--(BUSINESS WIRE)--Nidec Corporation (TOKYO: 6594; OTC US: NJDCY) (the “Company” or “we”) hereby announces that Glass Lewis & Co., LLC (“Glass Lewis”), a leading proxy advisory firm, has issued a report recommending that shareholders vote “FOR” all proposals to be entered at the Company’s upcoming 53rd Regular General Meeting of Shareholders scheduled for June 18, 2026. The proposals: 1. Partial Amendments to the Articles of Incorporation 2. Election of eight Members of the Boar...

SYDNEY--(BUSINESS WIRE)--Morse Micro launches the MM8108-M20, a high-power Wi-Fi HaLow module for faster long-range IoT product development....

中国台湾台北--(BUSINESS WIRE)--(美国商业资讯)-- 台北国际电脑展(COMPUTEX)讯 – 深耕于高压集成电路高能效功率变换领域的知名公司Power Integrations（纳斯达克股票代号：POWI）今日推出两款全新超薄紧凑型辅助电源参考设计，专为800VDC AI数据中心打造。其中一款单路输出15W设计的尺寸仅为30mm×30mm，厚度为7mm；另一款隔离式、六路输出、35W设计的尺寸仅为80mm×60mm，厚度为8mm。这两款超紧凑型设计方案专为NVIDIA的Kyber液冷刀片式机架架构优化设计，可在布局密集的主配电板(PDB)上节省约30%空间，同时BOM元件数预计减少30%，进而简化设计并提升整体可靠性。这两款设计效率极高，在整个输入电压和负载范围内，效率均不低于88%。 Power Integrations高级培训经理Jason Yan表示，“Power Integrations是率先推出单HEMT 1700V GaN器件的公司，因此能够打造这款业界顶尖、高能效的反激式电源。该方案物料清单精简，同时可在800V母线电压下保持充足的安全裕量。市面上其他...

台北--(BUSINESS WIRE)--(美國商業資訊)-- 台北國際電腦展 （COMPUTEX）訊 – 深耕於高壓集成電路高效能功率轉換領域的知名企業Power Integrations（納斯達克代碼：POWI）今日推出兩款全新超薄緊湊型輔助電源參考設計，專為800VDC AI資料中心打造。其中，單路輸出15W實際的尺寸僅有30mm×30mm，厚度為7mm；另一款六路輸出、35W設計的尺寸僅有80mm×60mm，厚度為8mm。這兩款超薄電源專為輝達（NVIDIA）的Kyber液冷刀片式機架架構設計，可在佈局緊密的主配電盤 （PDB）上節省約30%空間，同時BOM零件數估計減少30%，進而簡化設計並提升整體可靠性。這兩款設計的效率極高，在整個輸入電壓和負載範圍內，效率均不低於88%。 Power Integrations資深培訓經理Jason Yan說：「 Power Integrations是率先推出單HEMT 1700V GaN元件的公司，因此能夠打造這款業界頂尖、高效能的返馳式電源。它的物料清單簡潔，同時可以在800V母線電壓下保持充足的安全裕度。市面上其他的替代方案均採用分立...