KAOHSIUNG, Taiwan--(BUSINESS WIRE)--Advanced Semiconductor Engineering, Inc (ASE, TAIEX: 2311, NYSE:ASX), the leading provider of semiconductor assembly and test services, today held a groundbreaking ceremony at the site of its K24 building in the Nantze Export Processing Phase 2 Zone in Kaohsiung, Taiwan. The building is part of ASE’s continued expansion plans for its research and development, and manufacturing campus in Taiwan.
The 66,120 square meter K24 building will be the latest green building in ASE that incorporates green design in its construction with permeable pavement, stormwater management, earthquake proofing, energy-efficient lighting and ergonomically constructed workspaces. K24 will be the benchmark for ASE’s future building and office designs and will promote a comfortable and more productive working environment for its employees.
The K24 facility will be one of ASE’s and the packaging industry’s core center of advanced development in IC packaging focusing on its leadership in system-in-package, 3D IC, fan-out wafer level packaging, system design and manufacturing technologies.
‘To address the increasing market opportunity for Internet-of-Things, wearable and automotive technologies, smart homes and cities, ASE recognizes the need to step up its investment in people and technologies,’ says Raymond Lo, President and General Manager of ASE Kaohsiung. ‘The company will continue to expand its operations from its base in Kaohsiung and to make a significant and positive impact on the local economy,’ he continued.
ASE is committed to its social responsibility of hiring local talent and in the creation of higher value-added high-tech jobs. When completed, the new building will add more than 1800 employees in its R&D labs and manufacturing facility.
About The ASE Group
The ASE Group is among the leading providers of independent semiconductor manufacturing services in assembly, test, materials and design manufacturing. As a global leader geared towards meeting the industry’s ever growing needs for faster, smaller and higher performance chips, the Group develops and offers a wide portfolio of technology and solutions including IC test program design, front-end engineering test, wafer probe, wafer bump, substrate design and supply, wafer level package, flip chip, system-in-package, final test and electronic manufacturing services through Universal Scientific Industrial Co., Ltd. and its subsidiaries, members of the ASE Group. For more information about the ASE Group, visit www.aseglobal.com.
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