WILMINGTON, Mass.--(BUSINESS WIRE)--Rudolph Technologies, Inc. (NYSE: RTEC), a leading provider of process characterization equipment, lithography equipment and software for wafer fabs and advanced packaging facilities, announced today that Michael P. Plisinski, chief executive officer, and Steven R. Roth, chief financial officer, will be participating in several investor conferences during the Company’s second quarter. The presentation materials utilized during the respective conferences will be made accessible on the investor page of Rudolph Technologies’ website at www.rudolphtech.com.
17th Annual B. Riley Investor Conference /
May 25, 2016 / Hollywood, CA
Rudolph’s presentation at the 17th
Annual B. Riley Investor Conference is scheduled for Wednesday, May 25,
at the Loews Hollywood Hotel, in Hollywood, CA. The presentation, which
consists of a Fire Side Chat moderated by B. Riley’s semiconductor
capital equipment analyst Craig Ellis, will be at 8:30 a.m. PDT. Rudolph
management will be available to meet one-on-one with investors during
the conference. Interested investors should contact their B. Riley sales
representative to secure a meeting time.
DA Davidson Tech Forum / June 1, 2016 / New York, NY
Rudolph
will participate in the DA Davidson Tech Forum, taking place Wednesday,
June 1, at the Roosevelt Hotel, in New York, NY. The forum consists of
individual meetings scheduled with institutional investors that are
clients of DA Davidson. Interested investors should contact their DA
Davidson sales representative to secure a meeting time.
Cowen 44th Annual TMT Conference / June 2,
2016 / New York, NY
Rudolph’s presentation at the Cowen 44th
Annual TMT Conference is scheduled for Thursday, June 2, at the Lotte
New York Palace, in New York, NY. The presentation will be at 3:30 p.m.
EDT and will be webcast via the following URL: http://wsw.com/webcast/cowen32/rtec.
Rudolph management will be available to meet one-on-one with investors
during the conference. Interested investors should contact their Cowen
sales representative to secure a meeting time.
Stifel 2016 Technology, Internet & Media Conference / June 7, 2016 /
San Francisco, CA
Rudolph’s presentation at the Stifel
2016 Technology, Internet & Media Conference is scheduled for Tuesday,
June 7, at the Fairmont Hotel, in San Francisco, CA. The presentation
will be at 9:45 a.m. PDT. Rudolph management will be available to meet
one-on-one with investors during the conference. Interested investors
should contact their Stifel sales representative to secure a meeting
time.
Credit Suisse 8th Annual Semiconductor Supply Chain Conference / June
15, 2016 / Boston, MA
Rudolph will participate in the Credit
Suisse 8th Annual Semiconductor Supply Chain Conference,
taking place Wednesday, June 15, at the Credit Suisse offices, in
Boston, MA. The forum consists of individual meetings scheduled with
institutional investors that are clients of Credit Suisse. Interested
investors should contact their Credit Suisse sales representative to
secure a meeting time.
About Rudolph Technologies
Rudolph Technologies, Inc. is a
leader in the design, development, manufacture and support of defect
inspection, lithography, process control metrology, and process control
software used by semiconductor and advanced packaging device
manufacturers worldwide. Rudolph delivers comprehensive solutions
throughout the fab with its families of proprietary products that
provide critical yield-enhancing information, enabling microelectronic
device manufacturers to drive down costs and time to market of their
devices. Headquartered in Wilmington, Massachusetts, Rudolph supports
its customers with a worldwide sales and service organization.
Additional information can be found on the Company’s website at www.rudolphtech.com.