KYOTO, Japan--(BUSINESS WIRE)--Kyocera Corporation (NYSE:KYO)(TOKYO:6971) today announced that it will begin construction this week on a third manufacturing facility at its Kyoto Ayabe complex in Ayabe City, Kyoto Pref., Japan. The new facility will produce miniaturized, low-profile organic packages to house microelectronic devices used inside smartphones, tablet PCs and related mobile communications equipment.
Kyocera’s microelectronic packaging technology can facilitate higher functionality, greater integration and slimmer designs in mobile communications equipment. The market for Kyocera’s package products is expected to grow as consumer devices incorporate multiple internal modules for camera, wireless, power amplifier and control functions.
In addition, the expanding IoT (Internet of Things) trend is expected to generate new applications for Kyocera products as wireless chips and sensor chips are increasingly modularized into packaging solutions based on organic material technology.
Until April 1, 2016, the Kyoto Ayabe complex was operated by the former Kyocera Circuit Solutions, Inc. (“KCS”), Kyocera’s wholly owned subsidiary specializing in high-density organic wiring boards, packages and large-scale printed motherboards for semiconductor devices. On April 1, 2016, KCS was merged into Kyocera Corporation as part of a business integration strategy to enhance the development of new products and markets while further expanding business synergies.
Since 2005, Kyocera’s Kyoto Ayabe complex has manufactured a wide range of organic packaging products, including FC-BGA (flip-chip ball grid array) substrates for high-end application-specific integrated circuits (ASICs). Over the years, Kyocera has cultivated cutting-edge technologies in high-density wiring and automated production processes to create smaller, lower-profile products. Kyocera’s second facility at Kyoto Ayabe was added in the summer of 2014, and the third, targeted for completion in December 2016, will strategically expand the company’s capabilities.
|
Outline of the Third Facility |
||
| Name | Kyoto Ayabe Plant, Third Facility | |
| Location | Ayabe City, Kyoto Pref., Japan | |
| Facility size |
Building area: 13,143m2 (steel-framed, two floors,
140×84m)
Floor space: 25,420m2 |
|
| Construction plan |
Groundbreaking: April 21, 2016 (planned)
Completion: December 2016 (planned) |
|
| Start of operations | April 2017 (planned) | |
| Production | Organic packages for telecommunication devices | |
Note: The factory building will be designed with environmental consideration such as reuse of water emissions.
Kyocera Corporation (NYSE:KYO)(TOKYO:6971) (http://global.kyocera.com/), the parent and global headquarters of the Kyocera Group, was founded in 1959 as a producer of fine ceramics (also known as “advanced ceramics”). By combining these engineered materials with metals and integrating them with other technologies, Kyocera has become a leading supplier of solar power generating systems, mobile phones, printers, copiers, electronic components, semiconductor packages, cutting tools and industrial ceramics. During the year ended March 31, 2015, the company’s net sales totaled 1.53 trillion yen (approx. USD12.7 billion). Kyocera appears on the 2014 and 2015 listings of the “Top 100 Global Innovators” by Thomson Reuters, and is ranked #552 on Forbes magazine’s 2015 “Global 2000” listing of the world’s largest publicly traded companies.
