SANTA CLARA, Calif.--(BUSINESS WIRE)--eASIC Corp. (@easic), a fabless semiconductor company that delivers a custom integrated circuit (IC) platform (eASIC Platform), and ASOCS Ltd., a solution provider of virtual Base Stations (vBS) today announced that the eASIC Nextreme-3 platform was used by ASOCS to deliver significantly higher performance in its third generation modem processing unit (MPU) Hardware Acceleration (HWA). The delivery of the eASIC Nextreme-3 platform is part of a definitive agreement to develop custom silicon devices for the acceleration of next-generation network virtualization using the eASIC Nextreme-3 platform. The unique ASOCS architecture enables the software of all layers and functions of a base station to run in virtual machines, on standard commercial-off-the-shelf, Intel® Xeon-processors-based high volume IT servers, with a network attached multi-RAT hardware acceleration device based on the eASIC platform.
“We are delighted to not only deliver the first hardware accelerators based on the ASOCS architecture, but also meet their stringent performance requirements,” said Jasbinder Bhoot, eASIC, Vice President of Worldwide Sales and Marketing. “Our eASIC platform is ideal for applications that require new levels of compute and process intensive workloads while reducing power consumption over what can be achieved using FPGAs. The ASOCS architecture, comprised of the modem processing unit (MPU) and the modem programming language (MPL) software abstraction layer, enables the complete virtualization and software abstraction of the vBS L1 PHY.”
“The value of the single mask used to configure the eASIC Nextreme-3 devices is quite remarkable,” said Gaby Guri, Vice President of Research and Development, ASOCS. “It enabled us to meet all of our acceleration goals, which not only consist of performance, but also power consumption, and a critical schedule to first silicon. We look forward to continuing our relationship with eASIC.”
ASOCS will demonstrate its fully virtualized Base Station (vBS) solution this week during Mobile World Congress, Barcelona at the IMA Pavilion in Hall 2, Booth 2E46.
About eASIC
eASIC is a semiconductor company offering a differentiated solution that enables us to rapidly and cost-effectively deliver custom ICs, creating value for our customers’ hardware and software systems. Our eASIC solution consists of our eASIC platform which incorporates a versatile, pre-defined and reusable base array and customizable single-mask layer, our ASICs, delivered using either our easicopy or standard ASIC methodologies, and our proprietary design tools.
We believe this innovative technology allows eASIC to offer the optimal combination of fast time-to-market, high performance, low power consumption, low development cost and low unit cost for our customers. eASIC Corporation is headquartered in Santa Clara, California. Investors include Khosla Ventures, Crescendo Ventures, Seagate Technology, Kleiner Perkins Caufield and Byers (KPCB) and Evergreen Partners.
About ASOCS
ASOCS is a pioneer in the development of virtual Base Station (vBS) solutions. Enabled by its Modem Processing Unit (MPU), designed to meet current and future Multi - Radio Access Technologies (Multi-RAT) requirements, ASOCS enables the highest possible capacity baseband solutions for next-generation network topologies such as Cloud - Radio Access Networks (Cloud-RAN) and other wireless infrastructure cells from small to macro and beyond. For more information, visit www.asocsnetworks.com.
