Research and Markets: Bosch Sensortec BMG160 3-Axis MEMS Gyroscope Reverse Costing Analysis

DUBLIN--()--Research and Markets (http://www.researchandmarkets.com/research/nwt8zb/bosch_sensortec) has announced the addition of the "Bosch Sensortec BMG160 3-Axis MEMS Gyroscope Reverse Costing Analysis" report to their offering.

The first MEMS gyroscope of Bosch for Consumer Applications Employing a New Wafer Bonding Process

More than 10 years after the release of its MEMS gyroscopes for automotive, Bosch Sensortec release its first 3-Axis gyroscope for consumer applications.

In a market largely dominated by STMicroelectronics and InvenSense, Bosch Sensortec was the first to release a 3-axis MEMS gyroscope in a 3x3mm² package in order to gain market shares. Although the manufacturing process (Epi-poly surface micromachining) is similar to the one of automotive gyro, new processes for the capping and the wafer bonding has been adopted. Indeed, the classic "glass-frit" wafer bonding has been abandoned in favor of an eutectic bonding.

This report provides a complete teardown of the MEMS gyro with:

- Detailed photos

- Material analysis

- Schematic assembly description

- Manufacturing Process Flow

- In-depth manufacturing cost analysis

- Selling price estimation

Key Topics Covered

Glossary

Overview/Introduction

Bosch Company Profile

Physical Analysis

- Physical Analysis Methodology

- Package

- ASIC

- MEMS

Manufacturing Process Flow

- ASIC Process Flow

- Description of the ASIC Wafer Fabrication Unit

- MEMS Sensor Process Flow

- MEMS Cap Process Flow

- MEMS Wafer Bonding Process Flow

- Description of the MEMS Wafer Fabrication Unit

- Packaging Process Flow

Cost Analysis

- Main Steps of Economic Analysis

- Yields Hypotheses

- ASIC Front-End Cost

- ASIC Back-End 0 : Probe Test, Thinning & Dicing

- ASIC Die Cost

- MEMS Front-End Cost

- MEMS Front-End Cost per Process Steps

- MEMS Front-End : Equipment Cost per Family

- MEMS Front-End : Material Cost per Family

- MEMS Back-End 0 : Probe Test & Dicing

- MEMS Die Cost (Front End + Back End 0)

- Back-End : Packaging Cost

- Back-End : Final test & Calibration Cost

- Component Cost (FE + BE 0 + BE 1)

Estimated Price Analysis

For more information visit http://www.researchandmarkets.com/research/nwt8zb/bosch_sensortec

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Contacts

Research and Markets
Laura Wood, Senior Manager.
press@researchandmarkets.com
U.S. Fax: 646-607-1907
Fax (outside U.S.): +353-1-481-1716
Sector: Computing and Technology