ST. PAUL, Minn.--(BUSINESS WIRE)--Evergreen Medical Technologies has launched the Encompass Lead-Interconnect System, the first pretested integrated lead-interconnect system designed for implantable neurostimulator pulse generator (IPG) devices. The Encompass, enabled by Bal Seal Engineering’s SYGNUS® implantable contact system and rms Company’s premolded 16-channel header technology, saves development time and costs for neurostimulation device companies.
“For many years, both startups and established OEMs have been challenged to internally develop their own header and lead components or to outsource the development of each component to different contract manufacturers specializing in either lead components or headers,” says Randall Nelson, Founder and President of Evergreen Medical Technologies. “With our Encompass system, neurostimulator device companies no longer have to identify a different source for leads to coordinate with their IPG connectors. The Encompass provides complete functionality in a single system.”
Nelson says that developing a header system in-house or using multiple vendors can lead to significant integration, cost, and quality challenges. Sourcing the components separately can dramatically prolong device introduction, which commonly increases the overall developmental cost and adds a delay to initial clinical studies, he says.
Because the Encompass is pretested and already incorporates both the header and the interconnect system, it removes the roadblocks associated with design, development, sourcing, and testing of a final product. In addition, the system reduces the package size needed for different therapy options for IPG developers.
The Encompass has been designed with a port-entry screw-anchor mechanism and can use one of three lead strain relief seal options, varying from a short transition strain relief seal to a longer strain relief seal for devices requiring a more gradual lead transition from the header port. A slot is molded into the header for the placement of a radiopaque identifier and a suture hole is included. The header has been designed with a set of two anchors to firmly attach the header to the hermetic enclosure.
The Encompass will be featured at the International Neuromodulation Society 11th World Congress in Berlin June 8–13, 2013. The pretested header and interconnect system will be on display in the Evergreen Medical Technology booth #31. For more information, go to www.evergreenmedtech.com/encompass or e-mail encompass@evergreenmedtech.com.
About Evergreen Medical Technologies
Evergreen Medical Technologies designs, manufactures and tests Class II and Class III medical devices for entrepreneurs, startups and established companies worldwide. Evergreen has a deep history in implantable devices and intravenous devices, providing high quality, cost-effective, unique solutions for the new and innovative medical devices of its clients. For the latest news and information about Evergreen, visit www.evergreenmedtech.com, call 651.646.7700, or e-mail info@evergreenmedtech.com.
About Bal Seal Engineering, Inc.
Bal Seal Engineering, Inc. is a leading global provider of custom-engineered sealing, connecting, conducting and EMI shielding and grounding solutions. The company’s products employ unique Bal Seal Canted Coil Spring® technology for enhanced equipment performance and reliability. SYGNUS® is the world’s first integrated seal and electrical contact system for active implantable devices. For more information about SYGNUS, visit www.sygnus.com, call 800.366.1006, or e-mail sales@balseal.com.