ERFURT, Germany--(BUSINESS WIRE)--X-FAB Silicon Foundries, the leading foundry group in analog/mixed-signal semiconductor applications known for its expertise in “More than Moore” technologies, will present a free hour-long webinar next week, “On-Chip ESD Protection in Complex Analog/Mixed-Signal and High-Voltage Designs.” It explains how to eliminate the serious threat of electrostatic discharge (ESD) that can cause irreversible damage to integrated circuits (ICs). Please join X-FAB for this webinar to learn about various ESD protection concepts, and the structures and schemes available in X-FAB’s enhanced 0.35 and 0.18 micrometer high-voltage foundry processes to protect against electrostatic discharge. The webinar examines behavior, layout and application requirements. It also highlights similarities and differences among ESD protection concepts, outlining the advantages and disadvantages of each in circuit designs.
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WHO: |
Anyone wanting to learn about ESD protection methods and anyone |
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| involved in analog/mixed-signal design with a focus on optimizing for ESD | |||||
| robustness. | |||||
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WHAT: |
One-hour webinar that provides an overview of different ESD protection concepts. | ||||
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WHEN: |
Tuesday, March 6, 2012 |
Wednesday, March 7, 2012 |
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| 9:30 – 10:30 a.m. PST | 9 – 10 a.m. Central European Time (CET) | ||||
| 12:30 – 1:30 p.m. EST | 4 – 5 p.m. China/Taiwan | ||||
| 5 – 6 p.m. Korea/Japan | |||||
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WHERE: |
Online webinar; registration links: | ||||
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For North & South America: https://www2.gotomeeting.com/register/556664370 |
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For Europe & Asia: https://www2.gotomeeting.com/register/827388330 |
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WHY: |
Efficient, convenient way to become better informed about different ESD protection concepts. | ||||
About X-FAB
X-FAB is the leading analog/mixed-signal foundry group manufacturing silicon wafers for analog-digital integrated circuits (mixed-signal ICs). X-FAB maintains wafer production facilities in Erfurt and Dresden (Germany), Lubbock, Texas (US) and Kuching, Sarawak (Malaysia), and employs approximately 2,400 people worldwide. Wafers are manufactured based on advanced modular CMOS and BiCMOS processes with technologies ranging from 1.0 to 0.18 micrometers, for applications primarily in the automotive, communications, consumer and industrial sectors. For more information, please visit www.xfab.com.