PHOENIX--(BUSINESS WIRE)--Size, weight and power (SWaP) reductions are critical design factors for many of today’s defense, aerospace and medical applications.
Endicott Interconnect Technologies, Inc. (EI) is a leading developer of system-in-package (SiP) technical solutions that combine multiple integrated circuits (ICs), assembly and test technologies into high reliability modular IC packages. As the latest addition to the Avnet Electronics Marketing Americas line card, EI provides a powerful combination of CoreEZ® organic substrates and high performance HyperBGA® semiconductor packages to Avnet Electronics Marketing customers throughout the Americas.
Click to Tweet: Size, weight and power reductions made easy with Avnet Electronics Marketing’s addition of Endicott Interconnect.
“Avnet provides impressive design chain services to an expansive portfolio of customers in the aerospace and defense markets,” said Michael J. Hills, senior vice president of sales and marketing for Endicott Interconnect Technologies, Inc. “Collectively, we will offer highly reliable SWaP reduction solutions early in the design phase, which will shorten cycle times and bring the most competitive products to market faster.”
“Engineers, specifically in the mil/aero and medical industries, are looking for new ways to significantly reduce SWaP and gain a true competitive advantage,” said Bryan Brady, vice president, director of defense and aerospace for Avnet Electronics Marketing Americas. “The combination of Avnet’s FPGA/ASIC design capability and EI’s substrate and packaging expertise enables Avnet to provide game changing system-in-package solutions to our defense, aerospace and medical customers.”
EI products meet ISO, IPC and military specifications, RoHS compliance, ITAR registration and are compatible with lead free assembly processes.
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Additional Resources:
View our SlideShare presentations on:
Avnet Electronics Marketing, Endicott Interconnect and IBM’s Secure Micro Solutions
Avnet Electronics Marketing Defense/Aero Solutions Guide
About Endicott Interconnect Technologies, Inc.
Endicott Interconnect Technologies, Inc., with headquarters in Endicott, N.Y., is a vertically integrated provider of high performance electronic packaging solutions consisting of design and fabrication of printed circuit boards and advanced semiconductor packaging, full turnkey services for printed circuit board and integrated circuits assembly and test, as well as systems integration. EI product lines meet the needs of markets including defense and aerospace, communications and computing, semiconductor, advanced test equipment, and medical, where highly reliable products built in robust manufacturing operations are critical for success. With more than 45 years experience in providing microelectronics solutions, the company brings to market a unique mix of leading edge technology and technical know-how that provide customers with a time-to-market advantage and competitive differentiation. For more information about EI and its products, please visit www.endicottinterconnect.com.
About Avnet Electronics Marketing
Avnet Electronics Marketing is an operating group of Phoenix-based Avnet, Inc. that serves electronic original equipment manufacturers (EOEMs) and electronic manufacturing services (EMS) providers in more than 70 countries, distributing electronic components from leading manufacturers and providing associated design-chain and supply-chain services. The group's website is located at www.em.avnet.com.
About Avnet, Inc.
Avnet, Inc. (NYSE:AVT), a Fortune 500 company, is one of the largest distributors of electronic components, computer products and embedded technology serving customers in more than 70 countries worldwide. Avnet accelerates its partners' success by connecting the world's leading technology suppliers with a broad base of more than 100,000 customers by providing cost-effective, value-added services and solutions. For the fiscal year ended July 3, 2010, Avnet generated revenue of $19.16 billion. For more information, visit www.avnet.com.