POWAY, Calif.--(BUSINESS WIRE)--Cohu, Inc. (NASDAQ:COHU), a leading supplier of semiconductor test and inspection handlers, announced today the introduction of 3D Flex Vision system for Wafer Level Package (WLP) inspection. This new addition to Cohu’s NVcore vision technology portfolio brings the benefits of 3-dimensional measurement equipment into the volume production environment.
The 3D Flex Vision system is well suited for inspection of semiconductor products used in mobility and wireless communications markets, such as RF devices, small power management ICs and many other devices in Wafer Level Packages (WLPs), one of the fastest growing technologies, today representing nearly 20% of all 300 mm wafer-equivalent units, according to Yole Développement.
Based on Moiré interferometry, the 3D Flex Vision system combines a sequence of touchless 2-dimensional images with projected light patterns to generate high accuracy 3-dimensional measurement of inspected devices. This vision system generates a topographic view of devices, accurately measuring ball or bump height, coplanarity, quality and body warpage, enabling high-speed inspection of WLPs with micrometer resolution. When integrated into Cohu’s turret handlers it can reach production speeds of up to 30,000 units per hour.
About Cohu:
Cohu is a leading supplier of semiconductor test and inspection handlers, micro-electro mechanical system (MEMS) test modules, test contactors and thermal sub-systems used by global semiconductor manufacturers and test subcontractors.
Forward Looking Statements:
Certain matters discussed in this release, including statements concerning Cohu's 3D Flex Vision system are forward-looking statements that are subject to risks and uncertainties that could cause actual results to differ materially from those projected or forecasted. Such risks and uncertainties include, but are not limited to, our ability to convert new products under development into production on a timely basis, support product development and meet customer delivery and acceptance requirements for next generation equipment, failure to obtain customer acceptance resulting in the inability to recognize revenue and accounts receivable collection problems, our reliance on patents and intellectual property, compliance with U.S. export regulations, and the cyclical and unpredictable nature of capital expenditures by semiconductor manufacturers. These and other risks and uncertainties are discussed more fully in Cohu's filings with the Securities and Exchange Commission, including the most recently filed Form 10-K and Form 10-Q. Cohu assumes no obligation to update the information in this release.
