COLORADO SPRINGS, Colo.--(BUSINESS WIRE)--Photo Stencil, LLC, a leading full-service provider of high-performance stencils and tooling, will present the paper, Print Performance Studies Comparing Electroform and Laser-cut Stencils, at IPC APEX on Tuesday, March 25th from 1:30-3:30PM, Technical Session S04-Printing I. Presented by Rachel Miller-Short and written in collaboration with William E. Coleman Ph.D., Photo Stencil, and Joseph Perault, Parmi, the paper evaluates various stencil types available in the industry today to determine which provide the best paste release results for small apertures while providing enough solder paste volume for normal-sized SMT components. The study includes a comparison of laser-cut electroformed blank foils as an alternative to normal electroformed stencils, and, in addition to electroformed stencil variations, evaluated various coatings and post processed stencils.
“As components get smaller, it’s difficult to print solder paste to satisfy the requirements of both very small components, such as .4 and .3mm pitch CSPs, as well as normal SMT components,” explained Rachel Short, VP sales and marketing, Photo Stencil. “The large components require more solder paste volume for sufficient solder fillets after reflow; however, if the stencil normally used to print solder paste for SMT components is used for the small components, the apertures are so small that poor paste release may be encountered. The area ratio plays a large part in this dilemma. Our study details the performance of 12 stencils in 5 different categories.”
In addition, Dr. Coleman will present the poster “Two Print Stencil Systems” on Wednesday, March 26, at 3:30PM, in South Pacific Room F.
Contact Photo Stencil at info@photostencil.com or http://www.photostencil.com.
Photo at www.photostencil.com/images/Electroformed-Stencil-Comparison.jpg
About Photo Stencil
Photo Stencil, LLC provides high-performance stencils, squeegee blades, thick film and metal mask screens, and tooling for the surface mount assembly, solar, and semiconductor industries. Its innovations include the patented AMTX E-FAB® electroformed stencils, high-performance, proprietary NicAlloy™, NicAlloy-XT™, laser-cut, and chemetch stencils, and patented electroformed E-Blade® squeegee blade. Stencil design support and customer-specific design libraries are also provided. Founded in 1979, Photo Stencil is headquartered in Colorado Springs and has manufacturing facilities in Mexico and Malaysia. Follow us on www.Linkedin.com/company/Photo-Stencil-llc, visit www.photostencil.com, or email info@photostencil.com.
