SEOUL, South Korea--(BUSINESS WIRE)--Dongbu HiTek today confirmed that its specialized foundry processing is enabling the volume production of enhanced CMOS Image Sensor (CIS) chips developed by Foveon for its parent company, Sigma Corporation. The newly developed Foveon CIS chips, branded “X3 Quattro” direct image sensors, are now being deployed in Sigma’s new “dp2 Quattro” compact camera. As the first entry in this new camera line, Sigma’s dp2 Quattro will soon be followed by dp1 Quattro and dp3 Quattro models also incorporating X3 Quattro CIS chips manufactured by Dongbu HiTek.
“Foveon’s newly developed X3 Quattro sensors can deliver 39 megapixel-equivalent ultrahigh resolution to enable stunning image quality” said Jae Song, Dongbu HiTek EVP of marketing. “Compared to prior sensor designs, this represents a 30% increase in pixel detail without the need to increase chip size. We take great pride in being the only foundry capable of processing and manufacturing Foveon’s specialized sensors using a pixel-stacking architecture.” He noted that Dongbu HiTek has been processing and manufacturing innovative CIS devices for Foveon for over a decade, and that the latest 39 megapixel-equivalent sensor has been in production for more than nine months.
Dongbu HiTek continues to focus on serving specialized applications where it can achieve higher profit margins in return for adding higher value. Within the image sensor segment, the company has emerged a key supplier of specialty sensor chips for high-end cameras such as Sigma’s dp2 Quattro as well as for automobiles, medical equipment, CCTV, and game consoles. In forecasting growth of the worldwide image sensor market, iSuppli forecasts the market for specialized sensors will grow faster than the sensors targeting mainstream mobile handset applications.
About Dongbu HiTek
Dongbu HiTek Co., Ltd. specializes in developing superb analog and mixed-signal processing technologies. The company adds high value to advanced ICs with a processing portfolio that encompasses Analog CMOS, BCDMOS, High Voltage CMOS, CMOS Power Amplifier (PA), CMOS Image Sensor (CIS), Display Driver IC (DDI), Touch Screen Controller IC and Embedded Flash technologies. With its best-in-class BCDMOS technology, the company manufactures power management chips that serve numerous applications ranging from home and handheld electronics to automotive and industrial systems. Currently processing technologies at nodes ranging from 0.35 microns to 90 nanometers, the company complements its world class foundry capabilities with top quality design support, prototype verification and packaging/module development. Headquartered in Seoul, Dongbu HiTek publicly trades its stock under 000990 on the Korea Stock Exchange. For more information, visit www.dongbuhitek.com.