Research and Markets: Reverse Costing Report of the SETi UV LED UVTOP270-BL-TO39, an UltraViolet LED Supplied by Sensor Electronic Technology, Inc

DUBLIN--()--Research and Markets (http://www.researchandmarkets.com/research/w9svqz/seti_uv_led) has announced the addition of the "SETi UV LED UVTOP270-BL-TO39 Reverse Costing Analysis" report to their offering.

System Plus Consulting is proud to publish the reverse costing report of the SETi UV LED UVTOP270-BL-TO39, an UltraViolet LED supplied by Sensor Electronic Technology, Inc. (SETi).

Based on a complete teardown process, the report provides an estimation of the production cost as well as the selling price of the component.

Packaged in a TO39 package with a sapphire ball lens, the UVTOP270-BL-TO39 is a UV LED with a luminous Flux of 600µW at 20 mA at a wavelength of 270nm, which makes it suitable for disinfection, protein analysis and forensic analysis.

The light emitting layers are in epitaxial AlGaN on a sapphire substrate.

This Report Provides a Complete Teardown of the LED With:

- Detailed photos

- Material analysis

- Schematic assembly description

- Manufacturing Process Flow

- In-depth economical analysis

- Manufacturing cost breakdown

- Selling price estimation

Key Topics Covered:

1. Overview / Introduction

2. Company Profiles

3. Physical Analysis

- About the Physical Analysis

- Physical Analysis Methodology

- Package Characteristics

- Package Dimensions

- Package Cross section

- Package Substrate

- Package Phosphor

- Package Synthesis

- LED SEM details

- LED Cross section

- LED Synthesis

4. Manufacturing Process Flow

- LED Die Process Flow

- Packaging Process Flow

- Description of the Wafer Fabrication Units

- Description of the Assembly Unit

5. Cost Analysis

- Yield Hypotheses

- LED Front-End Cost

- Front-End : Wafer patterning Cost

- Front-End : Epitaxy Cost

- Front-End : Other Front-End Cost

- Front-End : Cost per Equipment Family

- Front-End : Cost per Consumable

- Back-End 0 : Probe Cost & Dicing

- LED Die Cost

- Back-End 1 : Packaging Cost & Final test

- Back-End 1 : Packaging cost per step

- Back-End 1 : Packaging consumable cost

- Component Manufacturing Cost

6. Estimated Manufacturer Price Analysis

- Manufacturers financial ratios

- Binning Impact on Manufacturing Price

- Ideal manufacturer Price

- Manufacturing Price with Binning Yield

For more information visit http://www.researchandmarkets.com/research/w9svqz/seti_uv_led

Contacts

Research and Markets
Laura Wood, Senior Manager.
press@researchandmarkets.com
U.S. Fax: 646-607-1907
Fax (outside U.S.): +353-1-481-1716
Sector: Telecommunications and Networks

Contacts

Research and Markets
Laura Wood, Senior Manager.
press@researchandmarkets.com
U.S. Fax: 646-607-1907
Fax (outside U.S.): +353-1-481-1716
Sector: Telecommunications and Networks