Research and Markets: The Worldwide IC Packaging Market - 2012 Edition - An Economic and Effective Tool for Assessing the Future of this Market

DUBLIN--()--Research and Markets (http://www.researchandmarkets.com/research/xsczw5/the_worldwide_ic_p) has announced the addition of the "The Worldwide IC Packaging Market - 2012 Edition" report to their offering.

Following a year of unprecedented growth in 2010(IC revenue grew 40.6% while units expanded 35.5%), 2011 experienced a slight downturn in the second half of the year. Semiconductor industry growth is expected to expand by only 4% in 2012 but take an upward path thereafter. Overall the IC market is being driven by demand for handheld consumer devices and the adjoining infrastructure. The automobile industry has recovered, which are laden with semiconductor devices, yet supply has been dampen with the tsunami flooding of Japan and Thailand. The economic uncertainty of Europe and developments in the Arab Spring are other affecting factors.

New Venture Research (NVR), in The Worldwide IC Packaging Market, 2012 Edition, analyzes the semiconductor industry and uses this analysis to forecast the future of the global IC packaging market. The report begins with an economic and industry overview, historic and future unit and revenue graphs, and a SATS company overview.

Following this high-level review, the report presents forecasts for each semiconductor product type, and segments these products by package family and I/O count range. Packaging revenue figures are displayed for each segment, based on prices charged in the contract assembly market. The package families are then rolled up by I/O count and semiconductor product. In doing so, the report generates the total value of the IC packaging industry.

Key Topics Covered:

Chapter 1: Introduction

Chapter 2: Executive Summary

Chapter 3: The State of the Industry

Chapter 4: IC Package Forecast by Product

Chapter 5:IC Package Forecast by Package Family

Chapter 6: Packaging Contractor Market

Chapter 7: Company Profiles

Companies Mentioned

- Amkor

- Anst China

- ASE

- Azimuth

- Carsem

- ChipMOS

- Cirtek

- CORWIL Technology

- FlipChip Int'l

- Hana

- Hana Micron

- I2A

- IDS Electronics

- Jiangsu Changjiang

- Lingsen Precision

- Millennium Microtech

- Naito Densei Kogyo

- NANIUM

- Nantong Fujitsu

- OSE

- Powertech

- Shinko Electric

- Signetics

- Sigurd

- Siliconware

- SPEL

- STATS ChipPAC

- Tianshui Huatian Tech

- Unisem

- UTAC

- Vigilant Technology

- XinTec

For more information visit http://www.researchandmarkets.com/research/xsczw5/the_worldwide_ic_p

Contacts

Research and Markets
Laura Wood, Senior Manager.
press@researchandmarkets.com
U.S. Fax: 646-607-1907
Fax (outside U.S.): +353-1-481-1716
Sector: Manufacturing and Industry, Semiconductor

Contacts

Research and Markets
Laura Wood, Senior Manager.
press@researchandmarkets.com
U.S. Fax: 646-607-1907
Fax (outside U.S.): +353-1-481-1716
Sector: Manufacturing and Industry, Semiconductor