LONDON--(BUSINESS WIRE)--By 2016 the thermal management technologies market will be worth nearly $11 billion, compared with a 2010 value of $7.5 billion and $8 billion in 2011. According to a new report available on companiesandmarkets.com, this robust market growth is being driven by the significant progression in the technologies associated with - and the demand for - electronic systems and devices.
The Market for Thermal Management Technologies
Thermal management is a phrase used when referring to the various tools and technologies deployed within electronic devices for temperature regulation purposes. The technologies tend to fall under on of the following headings, and are discussed at length within the report: Thermal management hardware (e.g., fans, blowers, heat sinks); thermal management software (e.g., computational fluid design (CFD), computational heat transfer (CHT), power management, circuit design, and other electronic design automation (EDA); thermal management interface products and thermal management substrates.
Of these, the dominant segment is thermal management hardware, holding over 84% of the market and valued at $6.7 billion in 2011. By 2016, it is expected to have grown at 6.4% CAGR, reaching over $9.1 billion. The interface, software and substrate technologies are worth approximately 5% each.
With a 37% market share, the largest geographical market is North America, trailed by Asia-Pacific which holds a 24% share. Increased consumer interest in mobile communications devices across all global regions has contributed to market growth.
The report addresses the global market for thermal management products during the period 2010 through to 2016. It examines the technological progress seen over the last decade, such as unit miniaturization and the improved functionality available from single unit devices.
The September 2011 thermal management technologies research report contains 192 pages of insight into the market for the period 2010-2016. Within the report are profiles of a number of key market players, including Amkor Technology, Materion Corp., Stats Chippac Ltd., Cooler Master, Diamonex, Hybricon, OSE, AI Technology, Bergquist Co., Chomerics, Cookson Electronics Assembly Materials, Henkel Corp., Lord Corp., Master Bond, Metal Matrix Cast Composites and Semiconductor Packaging Materials, Inc.
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