DUBLIN--(BUSINESS WIRE)--Research and Markets (http://www.researchandmarkets.com/research/f6e537/casio_fujitsu_wl_c) has announced the addition of the "Casio Fujitsu WL CSP Package Reverse Costing" report to their offering.
Reverse costing report of the latest Wafer Level Chipscale Package based on Casio Micronics EWLP technology and used by Fujitsu for device MB39C311A, a Power Management Unit + Audio Interface Unit IC fo rmobile phone.
Reverse Analysis Report of the largest size Fan-In Wafer Level Package, featuring 309 pins with a pitch of 0.4mm
EWLP is an advanced technology for WL-CSP. All the packaging operations are done at the wafer level. The ball pitch is only 0.4mm and only one redistribution layer is used for the 309 balls of this 7.45 x 7.45mm package. This WL-CSP is manufactured on 200mm wafers by Casio Micronics.
This report provides a complete teardown of the Casio Micronics/Fujitsu 0.4mm pitch WL-CSP package including:
- Detailed photos
- Material analysis
- Manufacturing Process Flow
- In-depth economical analysis
- Manufacturing cost-breakdown
- Selling price estimation
Key Topics Covered:
Overview / Introduction
- Executive Summary
- Reverse Costing Methodology
Fan-In package Principle
- Benefits of WL-CSP
- WL-CSP Process Flow
Physical Analysis
- Physical Analysis Methodology
- Mobile Phone & PCB
- MB39C311A circuit
- Underfill
- Die in the package
- Pads and the redistribution layer
- Aluminum pad
- Coupling layer
- Die metallization and passivation
- Bumping process
- Copper posts
- Summary of Physical Data
Manufacturing Process Flow
- The Process flow main steps
- WL-CSP Process Flow
- Redistribution and copper post
- Bumping and Dicing
Cost Analysis
- Assumptions
- Package Yields
- WL-CSP Wafer Cost
- Wafer Cost by Equipment Family
- Wafer Cost by Consumable Family
- WL-CSP Package Cost
- Synthesis of the Cost Analysis
Estimated Manufacturer Price Analysis
- Price definitions
- Manufacturers financial ratios
- Estimated manufacturer Price
Conclusion
For more information visit http://www.researchandmarkets.com/research/f6e537/casio_fujitsu_wl_c