SANTA CLARA, Calif.--(BUSINESS WIRE)--Physware, Inc., a leading provider of high-speed and high capacity 3D electro-magnetic solutions for Signal Integrity (SI), Power Integrity (PI), Electromagnetic Interference (EMI) Integrity and Simultaneous Noise Integrity (SNI), today announced that it will demonstrate cloud-scalable chip-package-system design solutions for the microelectronics industry at DesignCon 2011 being held at the Santa Clara Convention Center, Santa Clara, CA between January 31 to February 3, 2011.
Physware's high speed, high capacity, 3D, full-wave EM solutions enable broadband verification and design across the chip-package-board ecosystems. Physware's product line includes full 3D boundary-element-based electromagnetic field solvers, combining unprecedented accuracy, capacity and fast-solver-technology built from the ground-up to leverage multi-core CPUs and Cloud Computing.
What: Physware will demonstrate PhysWAVE, the 3D full-wave solution, calculating S/Y/Z parameters, E/H field distributions and current density profiles and PhysAPEX, the 3D electro-magneto-quasi-static (EMQS) solver, generating RLGC matrices, IBIS models and SPICE netlists compatible with most circuit simulators. Physware will show these solutions and new parallelization technologies running on a cluster of computers in the cloud, taking performance to a new level.
When: Tuesday, February 01, 2011 and Wednesday, February 02, 2011
Where: Booth #115, Santa Clara Convention Center, Santa Clara, CA
About Physware
Physware provides high-speed and high-capacity 3D electromagnetic signal integrity, power integrity and EMI analysis field solutions for the microelectronics industry. Physware’s accelerated technology delivers unprecedented capacity handling, significantly faster speed than current methodologies, and the ability to span the entire design cycle while maintaining concurrent, uncompromising Maxwell accuracy. Physware technology leverages the ongoing trend towards pervasive parallel computing, in particular Cloud Computing. The company’s patented physics-aware technology enables efficient chip-package-system co-design and robustness and efficiency at every step of the design cycle while significantly reducing time to market.
Physware is a venture-backed, privately-held company led by an experienced management team. The technology is based on multiple patented methodologies. For additional information, please visit www.physware.com or visit Physware at Booth #115 at DesignCon 2011.